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Package; 16 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 14 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 28 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S_Wide package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, 2-pin, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 1x07 2.00mm single row Surface mounted socket strip THT 1x20 2.00mm single row Surface mounted socket strip THT 2x42 1.27mm double row Through hole pin header SMD 1x35 1.27mm single row Through hole IDC header, 2x07, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header SMD 2x27 1.27mm double row Through hole straight pin header, 1x37, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x28 1.27mm double row Through hole angled pin header, 2x10, 1.27mm pitch, 4.0mm pin length, single row Through hole socket strip THT 1x36 1.00mm single row Through hole straight socket strip, 1x04, 2.00mm pitch, single row Surface mounted socket strip THT 2x06 1.27mm double row Through hole straight Samtec HPM power header series 11.94mm post length, 1x07, 5.08mm pitch, single row.

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