3
1
Back

Mm (242 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Piano, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 44 pins, single row style1 pin1 left Surface mounted socket strip THT 2x15 2.54mm double row Through hole angled pin header SMD 1x28 1.27mm single row style2 pin1 right Through hole straight socket strip, 2x15, 2.54mm pitch, 6mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip SMD 1x05 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x30, 2.00mm pitch, double rows Through hole angled pin header, 2x30, 1.00mm.

New Pull Request