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Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Minor layout tweaks Schematics/Fireball_VCO.pdf | Bin 0 -> 579684 bytes .../Pot_Knobs/pot_knob_two_parts_base.stl | Bin 0 -> 16700 bytes .../Panels/SPIDER CLIMB.png | Bin 0 -> 12821 bytes .../COLOR SPRAY.png | Bin 0 -> 292501.

6.918735e-001 -7.088008e+000 9.983999e+000 vertex.
, http://www.diodes.com/_files/packages/DO-15.pdf Diode DO-15 series.
Inductor,TDK, VLS-6045, 6x6x4.5mm, https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_power_vls6045ex_en.pdf inductor TDK.
, diameter*width=6*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf C Disc series.

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