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FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin variant by Heraeus, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch, right-angle, http://www.ckswitches.com/media/1422/js.pdf Surface Mount (SMT), Audio Jack Connector (https://www.cuidevices.com/product/resource/sj2-359x-smt.pdf Korean Hroparts Elec PJ-320D-4A (https://datasheet.lcsc.com/lcsc/1810121716_Korean-Hroparts-Elec-PJ-320D-4A_C95562.pdf smt female jack horizontal PJ311 6pin SMD 3.5mm headphones jack (http://www.china-bsun.com/Product48/1577.html headphones jack plug stereo 3.5mm PJ311 Headphones with microphone connector, 3.5mm, 4 pins (http://www.qingpu-electronics.com/en/products/WQP-PJ320E-177.html PJ31060-I 6pin SMD 3.5mm stereo headphones jack. Headphones jack plug stereo 3.5mm PJ311 Headphones with microphone connector, 3.5mm, 4 pins for trigger, gate, and CV lines? 3 5mm LEDs b1fcba1e78 Bring in diylc and openscad design Bring in diylc and openscad design Bring in diylc and openscad design ## Mechanical assembly Documentation # ---> KiCad # For PCBs designed using KiCad: https://www.kicad.org/ # Format documentation: http://kicad-pcb.org/help/file-formats/ # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= d9153c70802a10d2fe554f80f1a497b409aac630 531ebcae92ad8ad00635060e3583259ee13cc12b Add html test version Samurai Latest commits for file Synth_Manuals/VALMORIFICATION+Build+and+BOM.pdf MK_VCO/Fireball/Fireball VCO saw wave core.circuitjs.txt Fireball/fp-info-cache Normal file View File 3D Printing/Cases/Eurorack 2-Row/4c327a694daeb206e2eed537a2001b91_preview_featured.jpg Executable file View File Thu 22 Apr 2021 10:22:18 AM EDT R14, R15 values changed\ndue to availability Kassu used 1 uF | Polarized capacitor | | Tayda | A-001 | | Tayda | A-111 | | | | | | | J10 | 1 Hardware/lib/aoKicad | 1 | 10 uF tantalum\nMFOS 1, 1+15 electrolytic\n1 uF tanty looks better than EL\n(higher output, less leakage)\nbut only by a little. 1 µF tantalum.\nYuSynth 1, 10 µF tantalum.\nMFOS 1, 1+15 µF electrolytic.\n1 µF tanty looks better than EL\n(higher output, less leakage)\nbut only by a Contributor and that you.

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