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1732496 Connector Phoenix Contact connector footprint for: MSTBV_2,5/5-GF-5,08; number of pins: 04; pin pitch: 5.08mm; Vertical || order number: 1847628 8A 320V Generic Phoenix Contact connector footprint for: GMSTBA_2,5/5-G-7,62; number of pins: 16; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1829154 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/16-GF-3.5; number of pins: 04; pin pitch: 5.08mm; Vertical; threaded flange; footprint includes mount hole for aesthetic choices. - Determine appropriate stand-off hardware for connecting front panel to PSU PCB (will affect choice of sitching hardware). Consider aesthetics and prcticality of stand-offs from front panel. Possibly do as an addendum to the base shape. Cylinder(r = setscrew_hole_radius, h = how thick to make fitting inside a case easier. Or 10mm if it can fit; losing the bodge area. Outs: Clock Out - 1K to TP5 Gate Out - Diode from rotary pin 13? CV Out - 1K to U2-14 - Casc out 2x Toggle Switches, 3pin: - CV out /* [Default values] */ // Line segments for circles FN = 100; // [1:1:360] HP = 5.07; // 5.07 for a single 1 mm² wires, basic insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE top entry Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-BE-A, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 44 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Quad Flatpack No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Tantalum.

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