Labels Milestones
BackPLCC-4 ambient light sensor Fiber Optic Transmitter and Receiver ambient light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor chipled Broadcom DFN, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-04A2, example for new part number: 5273-08A example for new mpn: 39-30-0220, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack vertical Molex KK-254 Interconnect System, old/engineering part number: A-41791-0017 example for new part number: A-41791-0002 example for new part number: A-41792-0016 example for new mpn: 39-28-x08x, 4 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Diode SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, SM08B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-32DS-0.5V, 32 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 501331-1207 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Hirose series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-0821 (alternative finishes: 43045-240x), 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 8 leads; body width 4.4 mm; thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2020-6%20(Type%20C).pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-176 , 16 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0241, 24 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf.
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