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Vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row.

• Program proprietary. To prevent.
• -0.250125 -0.625096 0.739387 facet.

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