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Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 495.

• -0.081933 0.133696 0.98763 facet normal 0.243766.
• -0.758301 -0.622313 0.19418 facet normal.
• -0.165323 0.705976 facet normal -0.000000e+00 -1.000000e+00.
• 9.985641e-001 -0.000000e+000 vertex 4.952763e+000.
• Normal -3.508209e-001 -6.139373e-001 7.071109e-001.

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