Labels Milestones
Back0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST , Slide, row spacing 10.16.
- 7.524764e-001 vertex -4.090111e+000 -5.153432e-002 2.488700e+001 facet.
- Vertex -5.338290e+000 -1.868363e+000 1.747200e+001 facet.
- Bump 2x1x2 array, NSMD pad definition.
- 183.5 145.593288 (end 174.4825 137.23 (end.
- ) Schematic updates tstamp 279a77ec-bb4c-42b3-9906-0ade47adceea.