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2.553x2.579mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled socket strip THT 1x20 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x30 2.00mm single row Through hole IDC header, 2x05, 1.27mm pitch, single row style2 pin1 right Through hole pin header SMD 1x18 2.00mm single row Surface mounted socket strip THT 2x37 2.00mm double row Through hole angled socket strip THT 1x17 2.00mm single row Through hole straight pin header, 2x22, 1.00mm pitch, double rows Through hole Samtec HPM power header series 3.81mm post length THT 1x16 5.08mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x32, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted socket strip SMD 2x30 1.27mm double row Through hole angled pin header THT 1x17 2.54mm single row Through hole angled pin header THT 1x13 2.00mm single row style2 pin1 right Through hole angled pin header, 2x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin.

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