Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header, 1x05, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole IDC header, 2x08, 2.54mm pitch, 6mm pin length, single row Through hole straight socket strip, 2x05, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x13 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x06 2.00mm double row Through hole socket strip SMD 1x25 1.00mm single row Surface mounted socket strip SMD 2x36 1.27mm double row Through hole vertical IDC header THT 1x22 1.00mm single row Surface mounted socket strip THT 2x34 1.00mm double row Through hole socket strip THT 1x18 1.27mm single row Surface mounted socket strip THT 2x01 1.27mm double row Through hole IDC header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double.