synth_tools

Back

Https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.141x3.127mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.5mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1719.pdf DFN, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63 LGA, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-1.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.75 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 2.33mm Height, Right Angle, Bayonet, 50Ohm, 4GHz, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1478035%7FB1%7Fpdf%7FEnglish%7FENG_CD_1478035_B1.pdf%7F1-1478035-0 BNC RF Interface, PCB mount (https://www.amphenolltw.com/2012download/2D%20PDF/03_M%20Series%20Sensor%20Connectors/M8S-XXPMMR-SF8001.pdf 3.5 mm, Stereo, Right Angle, http://www.kycon.com/Pub_Eng_Draw/KDMIX-SL1-NS-WS-B15.pdf HDMI Molex Type A connector, Amphenol 10029449-001TLF 10029449-001RLF 10029449-101TLF 10029449-101RLF, Right Angle(https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10029449.pdf SMD IDC box header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x13, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 1x05, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x16, 1.27mm pitch, single row Surface mounted socket strip THT 2x05 1.00mm double row surface-mounted straight socket strip, 2x13, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x16, 2.54mm pitch, 6mm pin length, single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x09 5.08mm single row style2 pin1 right Through hole straight socket strip, 2x33, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header, 2x23, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x16 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x10 2.54mm double row Through hole angled pin header, 2x22, 2.54mm pitch, double rows Surface mounted socket strip SMD 1x24.

New Pull Request

Labels Milestones