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Sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator Inductor SMD Pulse PA4320 Pulse PA4344 PM4344 Series SMD Inductors Inductor, Sagami, h=6.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Inductor, Sagami, h=8.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Sagami power inductor, 3.0x2.8x2.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0705 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 3 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite 2 SMD.

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