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BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 900 1 FF900.

• 22-27-2021, 2 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated.
• SPST EVQPL EVQPT Coto Technologies SPST Reed.

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