synth_tools

Back

Strip, HLE-106-02-xx-DV-TE, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-124-02-xxx-DV-A, 24 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-35S-0.5SH, 35 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST XA series connector, B10P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0070, 7 Circuits (https://www.molex.com/pdm_docs/sd/2005280070_sd.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-D (7343-31 Metric), IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B6P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FF0841SA1, 41 Circuits (http://www.molex.com/pdm_docs/sd/5022504191_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-LC, 39 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 502386-1270 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator connector wire 0.25sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for a 1uF capacitor. 1uF may be used for a single 1.5 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex KK-254 Interconnect System, old/engineering part number: 22-27-2141, 14 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://www.ti.com/lit/ds/symlink/cc1101.pdf#page=101), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 10 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf LQFN, 48 Pin (https://github.com/KiCad/kicad-symbols/pull/1189#issuecomment-449506354), generated with kicad-footprint-generator connector Molex Mega-Fit side entry Molex 734 Male header.

New Pull Request

Labels Milestones