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Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 28-pin zero insertion force socket, through-hole, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 22-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (https://www.jedec.org/system/files/docs/MS-026D.pdf var ABC), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 32 leads; body width 5.3 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex KK-396 horizontal Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FF0825SA1, 25 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf.

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