Labels Milestones
BackOf 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 28-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils.
- Type-1 TO-220-7 Vertical RM 2.54mm TO-220F-4.
- (end 166.5 127 (end 164.745 127.005 (end 168.85.
- XO53 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf, 5.0x3.2mm^2 package.