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DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad 3x2mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator JST PH side entry JST NV series connector, B05B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Fuse SMD 2920 (7451 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 1 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.5mm, hole diameter 1.3mm, wire diameter 1.0mm low profile wire loop with bead as test Point, square 1.0mm side length, hole diameter 0.7mm, wire diameter 1.0mm test point wire loop with bead as test Point, square 2.5mm side length SMD rectangular pad as test Point, square 3.0mm side length test point wire loop with bead as test point, loop diameter 3.8mm, hole diameter 1.3mm, wire diameter 1.0mm low profile wire loop as test Point, diameter 2.5mm SMD pad as test Point, square 4.0mm side length, hole diameter 2.8mm SMD rectangular pad as test point, loop diameter 3.8mm, hole diameter 0.7mm, wire diameter 0.5mm test point SMD pad rectangle square THT rectangular pad as test Point, square 1.0mm side length test point THT pad THT pad as test Point, square 1.0mm side length, hole diameter 1.6mm Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=7.62mm, , length*diameter=13*4.5mm^2, Fastron, HCCC, http://www.fastrongroup.com/image-show/19/HCCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 21.80mm diameter 24.1mm Bourns 2200 L_Toroid, Horizontal series, Radial, pin pitch=5.30mm, , length*width=14*5.6mm^2, Bourns, 5700, http://www.bourns.com/docs/Product-Datasheets/5700_series.pdf L_Toroid Vertical series Radial pin.

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