Labels Milestones
BackSPST KingTek_DSHP07TJ, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 5.45mm TO-247-4, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 2.54mm IIPAK I2PAK TO-264-2, Horizontal, RM 2.54mm, staggered type-2 TO-220F-11, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 1.7mm Pentawatt.
- B11B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf.
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