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Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761.

• | A-1138 | .
• 10684, 7 pins, single row style2 pin1.
• Connector, 16 pins, dual row female.
• TSOP-xxxx, MINICAST package, see.
• Vertex 4.56864 5.73082 7.24568 facet normal.

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