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0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad LQFP, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-4)), generated with kicad-footprint-generator Connector Phoenix Contact SPT 5/11-V-7.5-ZB 1719406 Connector Phoenix Contact, SPT 2.5/7-H-5.0 Terminal Block, 1732506 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732506), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1621 (alternative finishes: 43045-080x), 4 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63R-4P-3.96DSA, 4 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer.

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