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SSOP20: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator connector JAE side entry Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-794067-x, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B08B-JWPF-SK-R (http://www.jst-mfg.com/product/pdf/eng/eJWPF1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2105, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector JST GH series connector, S12B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM05B-AUHKS-GA-TB (http://www.jst-mfg.com/product/pdf/eng/eAUH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV-BE, 43 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T4055-1)), generated with kicad-footprint-generator Hirose DF13 through hole, DF63R-4P-3.96DSA, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 2.5, Wuerth electronics 9774030982 (https://katalog.we-online.de/em/datasheet/9774030982.pdf), generated.

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