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FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole pin header SMD 1x17 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x25 2.54mm double row Through hole angled socket strip, 1x30, 1.00mm pitch, single row Through hole straight pin header, 2x31, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x36 2.00mm single row Through hole angled socket strip, 2x14, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x11 2.00mm double row Through hole angled socket strip THT 1x13 1.27mm single row style2 pin1 right Through hole straight Samtec HPM power header series 3.81mm post length THT 1x16 2.00mm single row Surface mounted socket strip SMD 1x04 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x33 2.54mm double row surface-mounted.

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