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Pin (https://www.qorvo.com/products/d/da007268), generated with kicad-footprint-generator JST SUR series connector, 502386-1570 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770968-x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63M-4P-3.96DSA, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1.5mm, hole diameter 1.0mm wire loop as test Point, square 1.0mm side length SMD rectangular pad as test Point, diameter 1.0mm wire loop as test Point, square 4.0mm side length test point THT pad rectangle square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 4 pin, 0.5mm square SMD rectangular pad as test point, pitch 2.0mm, hole diameter 0.7mm.

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