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(https://katalog.we-online.de/em/datasheet/9774130360.pdf), generated with kicad-footprint-generator JST XA series connector, 53780-0370 (), generated with kicad-footprint-generator Molex SPOX Connector System, 53048-1310, 13 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator connector JST LEA top entry Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-166 , 6 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 6 pin, 2.54mm pitch, 8.51mm socket length, single row Through hole pin header THT 1x40 2.54mm single row Through hole straight pin header, 2x01, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x30 2.54mm double row Through hole angled pin header THT 2x17 1.27mm double row Through hole angled pin header SMD 1x26 2.54mm single row Through hole horizontal IDC box header THT 1x15 1.00mm single row Through hole straight socket strip, 1x05, 2.54mm pitch, 8.51mm socket length, single row Surface mounted socket strip SMD 1x35 1.27mm single row Surface mounted socket strip THT 1x22 2.54mm single row Through hole straight pin header, 1x22, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x37 1.00mm single row Through hole socket strip THT 2x15 2.54mm double row Through hole angled socket.

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