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TO-220F-2, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220-11, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Horizontal RM 2.54mm TO-220-4, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 10.9mm TO-264-2, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.27mm, staggered type-1 TO-220F-15, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST KingTek_DSHP10TJ.

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