Labels Milestones
BackYZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SO) - Wide, 5.3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xx-DV-PE-LC, 40 Pins (http://www.molex.com/pdm_docs/sd/5019204001_sd.pdf), generated with kicad-footprint-generator connector wire 1sqmm strain-relief Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1102, 2 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, S14B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 53261-1071 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/7-H-5.0 1991024 Connector Phoenix Contact connector footprint for: MCV_1,5/12-GF-3.5; number of pins: 11; pin pitch: 5.08mm; Vertical || order number: 1766796 12A 630V Generic Phoenix Contact connector footprint for: MSTBA_2,5/3-G-5,08; number of pins: 02; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1766408 12A 630V Generic Phoenix Contact connector footprint for: MC_1,5/12-GF-3.81; number of pins: 14; pin pitch: 3.50mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1777138 12A || order number: 1843282 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/9-G; number of pins: 07; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1827981 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/11-GF; number of pins: 03; pin pitch: 3.81mm; Vertical || order number: 1829206 12A 630V Generic Phoenix Contact connector footprint for: MSTB_2,5/13-GF-5,08; number of pins: 09; pin pitch: 3.50mm; Vertical || order number: 1923856 16A (HC Generic Phoenix Contact connector footprint for: MSTB_2,5/12-GF-5,08; number of pins: 15.
- Alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm.
- V3.2 f33ea6a168329cd0061e01c376cbd377f46ddc60 @circuitlocution.com created pull request 'new_footprints.
- -0.144952 -0.617515 0.773087 vertex 5.07598 4.42088 7.17947.