Labels Milestones
BackMils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.61.
- Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK.
- Definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch.
- TO-220-8 (Multiwatt8), Vertical, 2.54mm.
- TR-x2D(C)(T) modules, http://iqrf.org/weben/downloads.php?id=104 Bluetooth v4.2 + NFC module.