Labels Milestones

Back

Mils SMD DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 3.81mm TO-264-5, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Low Profile.

• FGG484 Artix-7 BGA, 18x18 grid, 15x15mm.
• Annular, M8 mounting hole.
• -0.423669 0.0993152 facet normal 0.049734 0.0862121 0.995035 vertex.
• 3xAAA Keystone Battery Holder BH-331P Battery Type.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects