Labels Milestones
BackMask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic.
- 2.77mm mounting holes 63.5mm, distance.
- Vertex 5.047609e+000 -1.917738e-002 2.470218e+001 facet normal -0.100994.
- -0.679084 0.550873 0.485163 facet normal 0.00133256.
- SMD, DF12E3.0-30DP-0.5V, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf.