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BackDate Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes count 0 Minor layout tweaks Minor layout tweaks Finish schematic, add PDF Fix for component clearance, panel thickness from printer realities bugfix/10hp More layout updates Delete 'Panels/futura medium bt.ttf' 4d5fa6d903 Delete 'Panels/futura medium bt.ttf' Delete 'Panels/futura medium condensed bt.ttf' Delete 'Panels/futura medium bt.ttf' Delete 'Panels/futura medium condensed bt.ttf' Panels/futura medium condensed.
- See http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP.
- BSD: .. . . . .
- PTSM-0,5-8-2.5-H-THR pitch 2.5mm size 19.7x10mm^2 drill 1.2mm.