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Spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 5.45mm TO-247-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 5.45mm TO-247-4, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 2.286mm Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint] SOT-227 / SOT-227B / ISOTOP, M4 mounting hole 2.2mm no annular mounting hole 4.3mm m4 din965 Mounting Hole 2.7mm, no annular m4 din965 Mounting Hole 2.2mm, no annular, M5, DIN965.

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