Labels Milestones
BackPitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A.
- -1.365947e+000 -4.108084e+000 2.495526e+001 facet normal 0.880764 -0.468299.
- 0.0560446 0.995039 facet normal -0.106825.
- -9.758449e+01 1.060913e+02 2.550000e+00 facet normal -0.768461 -0.630682 0.108208.
- 2.506545e-001 9.567815e-001 facet normal 0.633165 -0.0623612 0.771501.
- Vertex -6.35181 -0.410784 7.71954 vertex -4.59658.