Labels Milestones
BackNote * A trill, generally three very fast notes on repique/caixa, two or three for surdos Add schematic, start on PCB sandwich, making some final-ish decisions about connecting to front panel Added schmancy pcb for v2 front panel and pcb into different files Altech AK300 serie terminal block RND 205-00297 pitch 5.08mm size 55.9x11.2mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-1,5-14-5.08 pitch 5.08mm length 16mm diameter 6.3mm height 11mm Non-Polar Electrolytic Capacitor CP Radial series Radial pin pitch 3.50mm diameter 8mm Electrolytic Capacitor CP Radial series Radial pin pitch 3.81mm size 22.8x7.3mm^2 drill 0.7mm pad 1.4mm terminal block RND 205-00025 pitch 10mm size 115x10.3mm^2 drill 1.3mm pad 2.6mm Altech AK300 terminal block, pitch 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 2.54mm TO-220-4, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 10.9mm TO-264-2, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-4, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package for Siemens SFH900 reflex photo interrupter coupler object detector Fiberoptic Reciver, RX, Toshiba, Toslink, TORX170, TORX173, TORX193, TORX194 Fiberoptic Reciver RX Toshiba Toslink TORX170 TORX173 TORX193 TORX194 IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Vishay CNY70 refective photo coupler package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 8 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0015 example for new part number: 22-27-2101, 10 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole.
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