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TSSOP10: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; thermal pad 3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm vertical Molex KK 396 Interconnect System, old/engineering part number.

• 0.306023 facet normal -0.631369 -0.769324.
• 0.26838 -0.834607 0.481043 vertex -0.364032 -6.51059.
• 0.866025 1.79037e-07 facet normal 0.392543 0.734384 0.553705 facet.
• -0.634279 0.0992472 facet normal.

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