Labels Milestones
Back10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header SMD 1x24 2.00mm single row style2 pin1 right Through hole pin header THT 2x31 1.27mm double row Through hole pin header, 2x23, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x13, 1.00mm pitch, single row Through hole pin header THT 1x21 2.54mm single row style2 pin1 right Through hole angled pin header THT 1x10 5.08mm single row Through hole angled pin header, 2x31, 1.27mm pitch, double rows Through hole socket strip SMD 1x10 1.00mm single row style1 pin1 left Surface mounted.
- 20, https://www.tracopower.com/products/tmlm.pdf ACDC-Converter TRACO TMG Series 15 ACDC-Converter.
- 81.75 (end 167.5 95.706712.
- 282834-8, 8 pins, pitch 5.08mm.