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Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin Placed - Wide, 5.3 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5130, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-14DP-0.5V, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA series connector, 502494-0370 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-32DP-0.5V, 32 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST VH series.

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