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Type-1 TO-220F-2, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.27mm staggered type-2 TO-220F-9 Vertical RM 1.27mm staggered type-1 TO-247-2, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220-4, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.7mm staggered type-2 TO-220F-4, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 10.9mm TO-264-3, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 2.54mm TO-126-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-5, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 2.54mm staggered type-2 TO-220F-9 Vertical RM 10.9mm TO-247-2, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-5, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.27mm staggered type-2 TO-220-7, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for Mini-Circuits case.

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