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Coilcraft, XAL7020-331, 8.0x8.0x2.0mm, https://www.coilcraft.com/getmedia/0197e98c-67f7-4375-9e38-14d7376a46f3/xal7020.pdf Inductor, Coilcraft, XAL1010-XXX, 10.5x11.8x10.0mm, https://www.coilcraft.com/getmedia/dd74e670-e705-456a-9a69-585fe02eaf3c/xal1010.pdf Inductor, Coilcraft, XAL8080-XXX, 8.3x8.8x8.0mm, https://www.coilcraft.com/getmedia/345e50d6-a804-4ecb-9a92-5185221faf3e/xal8080.pdf Coilcraft XFL2010, Shielded power inductor, 0808, 1.9x2.0mm, https://www.coilcraft.com/getmedia/50382b97-998f-4b75-b5ee-4a93b0ac4411/xfl2010.pdf Wire Wound Chip Common Mode Choke, https://www.coilcraft.com/pdfs/0603usb.pdf surface mount PLCC, 52 pins, surface mount PLCC, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-6)), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-770866-x, 2 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0630, 6 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin 2x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header THT 2x23 2.54mm double row Through hole angled pin header, 1x13, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x19 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x17 1.27mm double row Through hole IDC box header, 2x03, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x16 1.27mm single row style2 pin1 right Through hole IDC header, 2x32, 2.54mm pitch, 8.51mm socket length, single row Through hole straight socket strip, 1x33, 2.00mm pitch, single row style2 pin1 right Through hole angled socket strip SMD 1x16 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x19.

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