synth_tools

Back

Https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 7x7mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2118, 11 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, S5P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3, Wuerth electronics 9775076960 (https://katalog.we-online.com/em/datasheet/9775076960.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-16S-0.5SH, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100.

New Pull Request

Labels Milestones