3
1
Back

(4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (JEDEC MO-153 Var JD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight socket strip, 2x38, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 1x06 2.54mm single row Through hole horizontal IDC box header, 2x06, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x20 2.00mm double row Through hole angled pin header, 2x09, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x16, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x19, 1.27mm pitch, single row Through hole angled socket strip THT 1x26 2.54mm single row Surface mounted.

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