Labels Milestones
BackEspressif 15.4*15.4mm ESP32-S2-WROVER(-I) 2.4 GHz Wi-Fi and Bluetooth module Single 2.4 GHz Wi-Fi and Bluetooth combo chip Single 2.4 GHz Wi-Fi https://www.espressif.com/sites/default/files/documentation/esp32-s2-wroom_esp32-s2-wroom-i_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, SPDT, High Capacity, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron Relay, SPST, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT Schrack-RT2 RM5mm 16A 250V AC Relay Relay SPST Schrack-RP-II/1 RM5mm 8A 250V AC Relay Relay SPST Schrack-RP3SL RM5mm 16A 250V AC Relay Relay DPDT Finder 96.12 56.32 package for diode bridges, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 1x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7810345, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
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