Labels Milestones
BackTFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Thin Quad Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body (see Atmel Appnote 8826 10-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-lead though-hole.