Labels Milestones
BackEnhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package.
- -1.058099e+02 9.665134e+01 1.146144e+01 vertex -1.056995e+02 9.695134e+01 1.143256e+01 facet.
- Normal 0.0942416 0.028588 0.995139 vertex.
- Electronics 9774070360 (https://katalog.we-online.de/em/datasheet/9774070360.pdf), generated with kicad-footprint-generator Molex Sabre.