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Area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZP.

• Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 **Component Count:** 76 | Refs.
• 9.062919e-001 4.035546e-003 4.226331e-001 vertex.
• Fuseholder ATO Blade littelfuse Pudenz 2.
• XS3 FM CV XS2 1V/OCT.
• -0.314689 -0.466332 -0.826744 vertex -2.06806 2.03063.

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