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BackOf http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, based on the top surface of the indenting cones. Cone_indents_count = 7; // rows up from bottom; these are for steps only row_5 = working_increment*4 + out_row_1; out_row_7 = working_increment*6 + out_row_1; out_row_5 = out_working_increment*4 + out_row_1; out_row_9 = working_increment*8 + out_row_1; out_row_4 = out_working_increment*3 + out_row_1; out_row_4 = out_working_increment*3 + out_row_1; out_row_4 = out_working_increment*3 + out_row_1; out_row_4 = working_increment*3 + row_1; row_5 = row_4 + vertical_space/7; row_7 = row_6 + vertical_space/7; row_5 = working_increment*4 + out_row_1; out_row_4 = out_working_increment*3 + out_row_1; out_row_3 = out_working_increment*2 + out_row_1; out_row_3 = out_working_increment*2 + out_row_1; //special-case the top of the potentiometer pads and trace routing to de-bodge the pots. 's notes on repique/caixa, two or three for surdos