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Reserved. The MIT License Copyright (c) 2013 Mitchell Hashimoto Permission is hereby granted, free of charge, to any person obtaining a copy MIT License Copyright (c) 2014 Mark Bates MIT License (MIT) Copyright (c) 2015 Spring, Inc. Permission is hereby granted, free of charge, to any person obtaining a copy of this License from a base. Update readme Schematics/SEQ_MANUAL_v2.pdf | Bin 0 -> 31010 bytes Panels/label_test.stl | Bin 0 -> 104908 bytes Panels/title_test.scad | 27 Panels/title_test.stl | Bin 0 -> 11916 bytes .../MIRROR IMAGE.png | Bin 0 -> 659884 bytes Panels/title_test_22.stl | Bin 77965 -> 0 bytes Binary files /dev/null and b/3D Printing/Pot_Knobs/scaled_french_pot.mix differ Binary files /dev/null and b/Images/PXL_20210831_004139245.jpg differ Images/befaco_vcadsr.png Normal file View File footprint "Perfboard_1x12" (version 20221018) (generator pcbnew Show-stopping bugs needing bodges: Errant connection between R25 and R1. This needs to be more robust and easier to adjust parameters for. 1.0 2012-03-?? Initial release at https://www.thingiverse.com/thing:20513 . * @todo Refactor the scaling algorithm and parameters to be fixed elsewhere fix/merge_issues Start of LM13700 version to see why 744b72ef7e0d94fccfae99ec3cb3514981ac4616 2dd0b8c0c736720a0b064bbe1304dc9562beb260 init 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c Add schematic, start on PCB Added hard sync to schematic, laid out PCB with exploratory 8hp layout Schematics/Enlarge/Enlarge.kicad_prl | 77 Schematics/Enlarge/Enlarge.kicad_pro | 143 C1 is too small for a single 0.1 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose series connector, S05B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 33 Circuits (https://www.molex.com/pdm_docs/sd/5022313300_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0200, 20 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00015 pitch 5mm size 45x8.1mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix MKDS-1,5-10-5.08, 10 pins, pitch 10mm, size 55x10.3mm^2, drill diamater 1.2mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm².

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