Labels Milestones
BackQFN (3mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 7x-dip-switch.
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- Pin (http://www.thatcorp.com/datashts/THAT_5171_Datasheet.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP.