Labels Milestones
Back2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole.
- -0.643676 0.611197 facet normal -0.0961108 -0.94716.
- Plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic.