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XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header SMD 1x10 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x03 2.00mm double row Through hole angled socket strip, 2x31, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x27, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x34 2.00mm single row style2 pin1 right Through hole angled socket strip SMD 1x21 2.54mm single row Through hole pin header SMD 1x28 2.54mm single row Through hole angled pin header SMD 1x02 1.00mm single row Through hole angled pin header SMD 1x02 2.00mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x17 2.00mm single row Surface mounted pin header SMD 1x17 1.00mm single row Through hole angled socket strip, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x12 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x20 2.00mm double row Through hole angled pin header THT 1x27 1.00mm single row.

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